FRANK WILLY, CID

Crystal Lake, IL 60012

mwf50@comcast.net  815.479.9723 https://www.linkedin.com/pub/frank-willy/6/71b/2b7

 

 

 

SENIOR PRINTED CIRCUIT DESIGNER

Design top-performing products, significantly impacting bottom-lines results.

 

Results-driven, well-organized Certified Interconnect Designer with demonstrated record of success utilizing several different cad systems for manufacturability of printed circuit boards. Strong skills using tools and techniques along with layout capabilities and knowledge of rules and requirements that allow for development of layouts with outstanding performance and manufacturability along with mechanical integrity. Versatile team player who incorporates new concepts and interacts with all levels of professionals. 

Areas of Expertise Include:

� Performance Optimization

� Troubleshooting

� Problem Solving

� Production Manufacturability

� Testing and Evaluation

� Project Management

 

TECHNICAL SKILLS

 

� Mentor Graphics System v8 version b4, c2, c4 en2000.5, Cadence Allegro version 16.4 and CCT Spectra auto router experience.

� Familiar with multi-layer, high-density SMD through hole, micro vias, rigid, flex, rigid flex and thick film hybrids.

� Use Valor Enterprise, ODB++ and ADI XPro for manufacturability of printed circuit boards.

 

PROFESSIONAL EXPERIENCE

 

MOTOROLA MOBILITY LLC, Chicago, IL 2005 to 2015

Senior Printed Circuit Designer

* Realized millions in sales by creating Cadence Allegro 16.4 PCB design for high-density main printed circuit boards for mobile devices, including DROID X, DROID X2, DROID 4, DROID ULTRA, DROID TURBO and MOTO X PLAY that resulted in: 

o Cost reduction of newer designs.

o High-volume production.

o Quality product produced through team effort. 

o Highest quality mobile devices available today.

* Increased manufacturing and reduced cost by utilizing vSure (Valor) for checking for production and panelization.

* Verified power management, impedance control, MIPI and differential pairs that were critical to designs by using Cadence Constraint Manager.

 

MOTOROLA CGISS, Schaumburg, IL2004 to 2005

Senior Printed Circuit Designer

* Developed high-density, multi-layer printed circuit boards with SMD and micro vias using Mentor Graphics rev C2 design of 2-way police and emergency radios and accessories.

* Designed GPS feature in microphone part of 2-piece radio for police and fire department.

 

LUCENT TECHNOLOGY, Columbus, OH2000 to 2002

Senior Printed Circuit Designer, Contract Position

* Created high-performance repeater tower equipment using Mentor Graphics rev C2, C4 and EN2000.5 and Spectra router and Valor Enterprise for design of RF, analog and digital telecom.

 

 

FRANK WILLYmwf50@comcast.net  PAGE TWO

 

LUCENT TECHNOLOGY (Continued)

* Designed and modified equipment, including amplifiers, receivers and transmitters with micro strip and balanced strip lines for CDMA cell towers, including schematic capture, resulting in high-performance products that allowed for more data per user, and potential for better voice quality.

 

MOTOROLA A.I.E.G. (Automotive), Northbrook, IL1999 to 2000

Senior Printed Circuit Designer, Contract Position

* Attained new affordable products for automotive industry through Mentor Graphics rev B4, C2 Spectra auto router and ADI XPro PCB design of high-density analog and digital automotive equipment.

* Devised automotive body control models for power windows and seats that resulted in being next year�s accessory features for GM, Ford and Chrysler, to name a few.

* Designed power management boards for electric minivan, allowing for production of Chrysler�s first electric minivan.

 

TELLABS, Bolingbrook, IL1999

Senior Printed Circuit Designer, Contract Position

* Updated landline switching equipment through Mentor Graphics rev B4 and Spectra auto router PCB design of high-density digital telecom for BTM project, including schematic capture.

* Modified system management boards used in central office equipment, updating obsolete components for future production.

* Updated systems and performance of landline phone equipment for future production of new equipment.

 

MOTOROLA A.I.E.G. (Automotive), Northbrook, IL1998

Senior Printed Circuit Designer, Contract Position

* Utilized Mentor Graphics rev B4, C2 and ADI XPro PCB for design of high-density analog and digital automotive equipment that resulted in next year�s accessories and features for leading automotive manufacturers.

* Improved fuel economy and performance by designing engine control models for Chrysler that helped meet new government standards.

* Enhanced features and performance of new models by designing various body modules.

 

TELLABS, Bolingbrook, IL 1997 to 1998

Senior Printed Circuit Designer, Contract Position

* Merged 2 libraries into 1 through Mentor Graphics rev B4 Librarian creation and modification of geometries.

Senior Printed Circuit Designer, contract position 1997 to 1998

* Developed high-density critical length signals for 26 layer backplane for telecommunications equipment by utilizing Mentor Graphics rev B4 PCB design that was used in new landline network system.

 

EDUCATION / PROFESSIONAL DEVELOPMENT

 

* Coursework taken towards Automotive Electronics, St. Phillips College, San Antonio, TX

* Valor Basic Enterprise with ODB++

* Mentor Graphics Board Station, Auto-active RE

* IPC Certified Interconnect Designer

* Six Sigma Yellow Belt